Integrated closed cooling system for high-power chips

Abstract

With the innovation of high power and high integration for chips in microwave devices, the research of high-efficiency integrated cooling system is advancing. Current cooling architecture has disadvantages of poor impurity tolerance, large terminal heat exchanger, and low system reliability. An integrated closed cooling system is proposed to conquer cooling problems in radio frequency microsystem. A principle prototype of the closed cooling system is established, integrated with micropump, heat exchanger, and silicon based micro-channel substrate. A heat flux of 500 W/cm2 for high-power chip cooling is achieved with temperature rise less than 50 °C, which demonstrates high efficiency and reliability of present integrated closed cooling system.

Keywords

• Cooling architecture
• High-power chips
• Micro-channel
• Heat dissipation