The Effect of Organic Surface-Active Additives Upon the Kinetics of Electrodeposition of Ultrafine Copper Powder

Abstract

The influence of organic additives on the kinetics of electrodeposition of copper ions on the surface of the polycrystalline copper electrode from the mixed aqueous-organic solutions, the possibility of obtaining ultrafine powders of copper by electrolysis in a water-isopropanol solution of cupric nitrate in the presence of additives, polyvinyl alcohol and cationic amine containing polyelectrolyte VPK, are investigated in this work. It is shown that the organic surfactants can reduce the particle size of the copper powder and increase the homogeneity with respect to fractional composition.