Nanotechnology and Precision Engineering (Dec 2020)

Determination of failure degree of 1.2 kV SiC MOSFETs after short-circuit test using an improved test setup

  • Shen Diao,
  • Jun Sun,
  • Ziwei Zhou,
  • Zhenzhong Zhang,
  • Adolf Schöner,
  • Zedong Zheng,
  • Weiwei He

Journal volume & issue
Vol. 3, no. 4
pp. 235 – 240

Abstract

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Analysis of the short-circuit characteristics of SiC metal-oxide-semiconductor field-effect transistors (MOSFETs) is very important for their practical application. This paper studies the SiC MOSFET short-circuit characteristics with an improved test setup under different conditions. A high-current Si insulated gate bipolar transistor is used as a circuit breaker in the test circuit rather than the usual short-circuit test conducted without a circuit breaker. The test platform with a circuit breaker does not influence the calculation results regarding the short-circuit withstand time and energy, but the SiC MOSFET will switch off after failure in a very short time. In addition, the degree of failure will be limited and confined to a small area, such that the damage to the chip will be clearly observable, which is significant for short-circuit failure analysis.

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