Wafer products with non-traditional raw materials

Abstract

Fortification of recipes for products containing only refined raw materials, such as ice cream wafer cups, is a modern trend for such products. The use of soy okara in wet and dry form for these purposes allows you to unlock the potential of this raw material as an improver in the quality of wafer products. In the cup recipe, soy okara was added instead of flour dry matter in the amount of 10–30% in increments of 5%. In the wafer dough the mass fraction of moisture and spreadability were determined, in finished products - the mass fraction of moisture and wettability. It has been established that the use of wet and dry soy okara instead of the dry matter of flour in the formulations of wafer cups for ice cream allows increasing the moisture content of the dough by 2.3–4.9% and 3.6–8.8% and reducing its spreadability by 2–13 mm and 2–7 mm, respectively. In finished wafer cups, the introduction of wet and dry soy okara contributes to an increase in the mass fraction of moisture by 0.1 - 0.4% and 0.1 - 0.9%, a decrease in wetness by 2 - 22% and 2 - 15%, respectively, compared with the control sample. Rational dosage was taken 15% of dry soy okara and 20% dry soy okara instead of flour dry matter in the wafer cup recipe. At the same time, the wettability of finished products is reduced by 5–6%, which will positively affect the consumer properties of finished products when stored with ice cream. In experimental products, the amount of carbohydrates decreases by 4.9 - 5.9%, cellulose - increases by 78 and 87 times, calcium - by 1.5-1.8 times, the energy value decreases by 1.4 - 1.7%, and the biological value increases by 2.9 - 3.4% compared with control sample.