Scientific Reports (Sep 2021)
Fabrication of a state of the art mesh lock polymer for water based solid free drilling fluid
Abstract
Abstract Polymers are used widely in various kinds of drilling fluid to maintain the proper rheological properties. However, most of them are not available for high-temperature or salt solutions due to poor temperature and salt resistance. To ameliorate the temperature and salt resistance of polymer used in the solid-free water-based drilling fluid, a novel polymer with a kind of "Mesh-Lock" reinforced network cross structure, named PLY-F [main monomer acrylic acid (AA), acrylamide (AM), functional monomers 2-acrylamide-2-methylpropanesulfonic acid (AMPS) N-vinylpyrrolidone (NVP) and C16DMAAC] were prepared through free radical polymerization of an aqueous solution of organic cross-linking agent pentaerythritol triallyl ether (PTE) as a cross-linking system, Potassium persulfate (KPS) and sodium bisulfite as the initiator for the first time. The surface morphology, crosslinking architecture and temperature and salt resistance of the PLY-F were fully characterized with several means including SEM, FT-IR, 13CNMR, dynamic rheology, and long-term thermal stability. The SEM observation indicated that the PLY-F exhibits a regular “Mesh-Lock” reinforced network cross structure. FT-IR, 13CNMR analysis indicated that the characteristic functional groups of each monomer such as AM, AA, AMPS and NVP were all together in the polymer. The results show that the apparent viscosity retention rate of the PLY-F in the potassium formate solution (with a density of 1.3 g/cm3) was more than 80% after heat rolling for 72 h at 200 °C and the plastic viscosity retention rate reached 90.3%. Moreover, the salt resistance of the polymer can reach the density of 1.4 g/cm3 (potassium formate solution) under 200 °C and the temperature resistance can reach 220 °C under the density of 1.3 g/cm3 (potassium formate solution). Besides, the PLY-F still has good rheological properties in other saturated solutions (NaCl, HCOONa) under 210 °C.