Cailiao Baohu (Mar 2023)

Determination of Content of Polyethylene Glycol 6000 in HEDP Copper Plating Solution

  • YANG Zhi-ye, CUI En-zhuang, WANG Jin-jun, LI Yang, QIU Yuan

DOI
https://doi.org/10.16577/j.issn.1001-1560.2023.0075
Journal volume & issue
Vol. 56, no. 3
pp. 181 – 182

Abstract

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The content of polyethylene glycol 6000 in Hydroxyethylidene diphosphonic acid (HEDP) copper plating solution was determined and studied by iodine precipitation-spectrophotometry.Results showed that the copper ions in HEDP copper plating solution reacted with iodine and interfered with the measurement results.After shielding copper ions with oxalic acid，the content of polyethylene glycol 6000 in HEDP copper plating solution could be accurately determined.The standard recovery rate was 98.08%～99.12%，and the recovery rate of spiking was 98.24%～98.80%.Moreover，the error of measurement method could meet the requirement of production control.

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