AIP Advances (Jun 2016)

Microfabrication of large-area circular high-stress silicon nitride membranes for optomechanical applications

  • E. Serra,
  • M. Bawaj,
  • A. Borrielli,
  • G. Di Giuseppe,
  • S. Forte,
  • N. Kralj,
  • N. Malossi,
  • L. Marconi,
  • F. Marin,
  • F. Marino,
  • B. Morana,
  • R. Natali,
  • G. Pandraud,
  • A. Pontin,
  • G. A. Prodi,
  • M. Rossi,
  • P. M. Sarro,
  • D. Vitali,
  • M. Bonaldi

DOI
https://doi.org/10.1063/1.4953805
Journal volume & issue
Vol. 6, no. 6
pp. 065004 – 065004-8

Abstract

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In view of the integration of membrane resonators with more complex MEMS structures, we developed a general fabrication procedure for circular shape SiNx membranes using Deep Reactive Ion Etching (DRIE). Large area and high-stress SiNx membranes were fabricated and used as optomechanical resonators in a Michelson interferometer, where Q values up to 1.3 × 106 were measured at cryogenic temperatures, and in a Fabry-Pérot cavity, where an optical finesse up to 50000 has been observed.