Journal of Agricultural Machinery (Mar 2024)

A Finite Element Model of Soil-Stress Probe Interaction under a Moving Rigid Wheel

  • M. Naderi-Boldaji,
  • H. Azimi-Nejadian,
  • M. Bahrami

DOI
https://doi.org/10.22067/jam.2023.84158.1185
Journal volume & issue
Vol. 14, no. 1
pp. 49 – 67

Abstract

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Machinery traffic is associated with the application of stress onto the soil surface and is the main reason for agricultural soil compaction. Currently, probes are used for studying the stress propagation in soil and measuring soil stress. However, because of the physical presence of a probe, the measured stress may differ from the actual stress, i.e. the stress induced in the soil under machinery traffic in the absence of a probe. Hence, we need to model the soil-stress probe interaction to study the difference in stress caused by the probe under varying loading geometries, loading time, depth, and soil properties to find correction factors for probe-measured stress. This study aims to simulate the soil-stress probe interaction under a moving rigid wheel using finite element method (FEM) to investigate the agreement between the simulated with-probe stress and the experimental measurements and to compare the resulting ratio of with/without probe stress with previous studies. The soil was modeled as an elastic-perfectly plastic material whose properties were calibrated with the simulation of cone penetration and wheel sinkage into the soil. The results showed an average 28% overestimation of FEM-simulated probe stress as compared to the experimental stress measured under the wheel loadings of 600 and 1,200 N. The average simulated ratio of with/without probe stress was found to be 1.22 for the two tests which is significantly smaller than that of plate sinkage loading (1.9). The simulation of wheel speed on soil stress showed a minor increase in stress. The stress over-estimation ratio (i.e. the ratio of with/without probe stress) noticeably increased with depth but increased slightly with speed for depths below 0.2 m.

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