Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution

Jan-Ervin C. Guerrero; Drexel H. Camacho; Omid Mokhtari; Hiroshi Nishikawa

doi:10.1155/2018/6580750

International Journal of Corrosion (Jan 2018)

Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution

Jan-Ervin C. Guerrero,
Drexel H. Camacho,
Omid Mokhtari,
Hiroshi Nishikawa

Affiliations

Jan-Ervin C. Guerrero: Chemistry Department, De La Salle University, 2401 Taft Avenue, 0922 Manila, Philippines
Drexel H. Camacho: Chemistry Department, De La Salle University, 2401 Taft Avenue, 0922 Manila, Philippines
Omid Mokhtari: Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan
Hiroshi Nishikawa: Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan

DOI: https://doi.org/10.1155/2018/6580750
Journal volume & issue: Vol. 2018

Abstract

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The corrosion and leaching behaviour of a new ternary Sn-0.7Cu-0.05Ni alloy in 3.5 wt.% NaCl solution is reported herein. Potentiodynamic polarization measurements show that Sn-0.7Cu-0.05Ni has the highest corrosion rate. Results of the 30-day Sn leaching measurement show that Sn-Cu-Ni joint has slight decrease attributed to the formation of thin passivation film after 15 days. The leaching amounts of Sn are observed to be higher in solder joint than in solder alloy due to the galvanic corrosion happening on the surface. EDS and XRD results of the corroded surface confirm that the corroded product is made up of oxides of tin.

Published in International Journal of Corrosion

ISSN: 1687-9325 (Print); 1687-9333 (Online)
Publisher: Wiley
Country of publisher: United Kingdom
LCC subjects: Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
Website: https://www.hindawi.com/journals/ijc/

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