Colloidal semiconductor nanocrystals for light emission and photonic integration

Huan Liu; Dabin Lin; Puning Wang; Tingchao He; Rui Chen

Chip (Mar 2024)

Colloidal semiconductor nanocrystals for light emission and photonic integration

Huan Liu,
Dabin Lin,
Puning Wang,
Tingchao He,
Rui Chen

Affiliations

Huan Liu: Department of Electrical and Electronic Engineering, Southern University of Science and Technology, Shenzhen 518055, China
Dabin Lin: Department of Electrical and Electronic Engineering, Southern University of Science and Technology, Shenzhen 518055, China
Puning Wang: Department of Electrical and Electronic Engineering, Southern University of Science and Technology, Shenzhen 518055, China
Tingchao He: Key Laboratory of Optoelectronic Devices and Systems of Ministry of Education and Guangdong Province, College of Physics and Optoelectronic Engineering, Shenzhen University, Shenzhen 518060, China; Corresponding author.
Rui Chen: Department of Electrical and Electronic Engineering, Southern University of Science and Technology, Shenzhen 518055, China; Corresponding author.

Journal volume & issue: Vol. 3, no. 1
p. 100073

Abstract

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Solution-processed colloidal semiconductor nanocrystals (NCs) have become attractive materials for the development of optoelectronic and photonic devices due to their inexpensive synthesis and excellent optical properties. Recently, CdSe NCs with different dimensions and structures have achieved significant progress in photonic integrated circuits (PICs), including light generation (laser), guiding (waveguide), modulation, and detection on a chip. This article summarizes the development of CdSe NCs–based lasers and discusses the challenges and opportunities for the application of CdSe NCs in PICs. Firstly, an overview of the optical properties of CdSe-based NCs with different dimensions is presented, with emphasis on the amplified stimulated emission and laser properties. Then, the nanophotonic devices and PICs based on CdSe NCs are introduced and discussed. Finally, the prospects for PICs are addressed.

Published in Chip

ISSN: 2709-4723 (Print); 2772-2724 (Online)
Publisher: Elsevier
Country of publisher: Netherlands
LCC subjects: Technology: Technology (General): Industrial engineering. Management engineering: Information technology
Website: https://www.sciencedirect.com/journal/chip

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