Recent Progress of Electromagnetic Field Characterization of Chip Surface

Huan Fei Wen; Tao Pei; Yu Wang; Yuchong Jin; Ding Wang; Zhonghao Li; Hao Guo; Zongmin Ma; Jun Tang; Jun Liu

doi:10.34133/adi.0055

Advanced Devices & Instrumentation (Jan 2024)

Recent Progress of Electromagnetic Field Characterization of Chip Surface

Huan Fei Wen,
Tao Pei,
Yu Wang,
Yuchong Jin,
Ding Wang,
Zhonghao Li,
Hao Guo,
Zongmin Ma,
Jun Tang,
Jun Liu

Affiliations

Huan Fei Wen: North University of China, Key Laboratory of Instrument Science and Dynamic Testing, Ministry of Education, Taiyuan, Shanxi, China.
Tao Pei: North University of China, Key Laboratory of Instrument Science and Dynamic Testing, Ministry of Education, Taiyuan, Shanxi, China.
Yu Wang: North University of China, Key Laboratory of Instrument Science and Dynamic Testing, Ministry of Education, Taiyuan, Shanxi, China.
Yuchong Jin: North University of China, Key Laboratory of Instrument Science and Dynamic Testing, Ministry of Education, Taiyuan, Shanxi, China.
Ding Wang: North University of China, Key Laboratory of Instrument Science and Dynamic Testing, Ministry of Education, Taiyuan, Shanxi, China.
Zhonghao Li: North University of China, Key Laboratory of Instrument Science and Dynamic Testing, Ministry of Education, Taiyuan, Shanxi, China.
Hao Guo: North University of China, Key Laboratory of Instrument Science and Dynamic Testing, Ministry of Education, Taiyuan, Shanxi, China.
Zongmin Ma: North University of China, Key Laboratory of Instrument Science and Dynamic Testing, Ministry of Education, Taiyuan, Shanxi, China.
Jun Tang: North University of China, Key Laboratory of Instrument Science and Dynamic Testing, Ministry of Education, Taiyuan, Shanxi, China.
Jun Liu: North University of China, Key Laboratory of Instrument Science and Dynamic Testing, Ministry of Education, Taiyuan, Shanxi, China.

DOI: https://doi.org/10.34133/adi.0055
Journal volume & issue: Vol. 5

Abstract

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The rapid development of chip manufacturing technology has increased the demand for precise characterization techniques. The characterization technique of the physical field on the surface of a chip is crucial for analyzing chip failures and diagnosing faults. In this review, the latest advancements based on different measurement mechanisms are analyzed and summarized for the electromagnetic field characterization of the chip surfaces. In addition, their advantages and limitations are discussed. Finally, prospects for future development are presented.

Published in Advanced Devices & Instrumentation

ISSN: 2767-9713 (Online)
Publisher: American Association for the Advancement of Science (AAAS)
Country of publisher: United States
LCC subjects: Technology: Electrical engineering. Electronics. Nuclear engineering: Electronics; Technology: Engineering (General). Civil engineering (General): Applied optics. Photonics
Website: https://spj.sciencemag.org/journals/adi/

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