Chemical Mechanical Polishing for Oxygen Free Copper with Manganese Oxide Abrasives

Abstract

The purpose of this study is to make clear the polishing characteristics of the manganese oxide slurry for wire material of Cu. To examine the polishing characteristics of the manganese oxide slurry, a series of polishing experiments for oxygen free copper have been carried out by using MnO2, Mn2O3 and Al2O3 as abrasive grains and polishing properties have been discussed. As a result, the best result among three kinds of slurries is obtained in polishing with Mn2O3 slurry at the viewpoints of the stock removal and surface roughness. Furthermore polished surfaces have been analyzed using SEM and atomic force microscope. While a large number of mechanical scratches are observed in the polished surface with Al2O3 slurry, the polished surfaces with manganese oxide slurries are covered with fine protrusions. It seems that the fine protrusions result from interaction between mechanical and chemical effects.

Keywords

• chemical mechanical polishing
• manganese oxide abrasives
• oxygen free copper
• polishing rate
• surface roughness