Study on Thermomechanical Properties and Morphology of an Epoxy Resin Thermally Conductive Adhesive under Different Curing Conditions

• Cheng Zhang,
• Zhe Xu,
• Yingxuan Huang,
• Yuefeng Li,
• Yang Li,
• Bobo Yang,
• Rongrong Hu,
• Jun Zou,
• Changran Zheng,
• Qi Qian

Affiliations

Cheng Zhang

School of Science, Shanghai Institute of Technology, Shanghai, China

Zhe Xu

School of Science, Shanghai Institute of Technology, Shanghai, China

Yingxuan Huang

School of Science, Shanghai Institute of Technology, Shanghai, China

Yuefeng Li

School of Science, Shanghai Institute of Technology, Shanghai, China

Yang Li

School of Materials Science and Engineering, Shanghai Institute of Technology, Shanghai, China

Bobo Yang

School of Science, Shanghai Institute of Technology, Shanghai, China

Rongrong Hu

School of Science, Shanghai Institute of Technology, Shanghai, China

Jun Zou

School of Science, Shanghai Institute of Technology, Shanghai, China

Changran Zheng

Academy for Engineering and Technology, Fudan University, Shanghai, China

Qi Qian

Zhejiang Silanex Technology (Taizhou) Co., Ltd., Taizhou, Zhejiang, China