Performance of amorphization AlCrTiZrMo high entropy alloy barrier for copper metallization

Shunian Chen; Yifan Zhang; Lin Chen; Xiaoping Ouyang; Bin Liao

Journal of Materials Research and Technology (Jan 2024)

Performance of amorphization AlCrTiZrMo high entropy alloy barrier for copper metallization

Shunian Chen,
Yifan Zhang,
Lin Chen,
Xiaoping Ouyang,
Bin Liao

Affiliations

Shunian Chen: Key Laboratory of Beam Technology of Ministry of Education, College of Nuclear Science and Technology, Beijing Normal University, Beijing, 100875, China; Advanced Institute of Natural Sciences, Beijing Normal University at Zhuhai, Zhuhai, 519087, China
Yifan Zhang: Key Laboratory of Beam Technology of Ministry of Education, College of Nuclear Science and Technology, Beijing Normal University, Beijing, 100875, China; Advanced Institute of Natural Sciences, Beijing Normal University at Zhuhai, Zhuhai, 519087, China
Lin Chen: Advanced Institute of Natural Sciences, Beijing Normal University at Zhuhai, Zhuhai, 519087, China
Xiaoping Ouyang: Key Laboratory of Beam Technology of Ministry of Education, College of Nuclear Science and Technology, Beijing Normal University, Beijing, 100875, China; Advanced Institute of Natural Sciences, Beijing Normal University at Zhuhai, Zhuhai, 519087, China; Corresponding author. Key Laboratory of Beam Technology of Ministry of Education, College of Nuclear Science and Technology, Beijing Normal University, Beijing, 100875, China.
Bin Liao: Key Laboratory of Beam Technology of Ministry of Education, College of Nuclear Science and Technology, Beijing Normal University, Beijing, 100875, China; Advanced Institute of Natural Sciences, Beijing Normal University at Zhuhai, Zhuhai, 519087, China; Corresponding author. Key Laboratory of Beam Technology of Ministry of Education, College of Nuclear Science and Technology, Beijing Normal University, Beijing, 100875, China.

Journal volume & issue: Vol. 28
pp. 2868 – 2875

Abstract

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A reliable ultra-thin diffusion barrier is required for Cu interconnection. High entropy alloy (HEA) films have received attention in the development of diffusion barrier materials due to their remarkable properties. Here, the dense and smooth 17 nm AlCrTiZrMo high entropy alloy amorphous film (HEAAF) is obtained by the cofilter cathode vacuum arc deposition. After annealing at 700 °C for 1 h, no Cu-silicide compounds are formed and the sheet resistance is 0.27 Ω/□, which indicated that AlCrTiZrMo HEAAF has excellent diffusion barrier performance. Such barrier temperature is comparable to some ceramic barriers. The excellent diffusion barrier performance of AlCrTiZrMo HEAAF is due to its good stability of amorphous structure and chemical stability at high temperature.

Published in Journal of Materials Research and Technology

ISSN: 2238-7854 (Print); 2214-0697 (Online)
Publisher: Elsevier
Country of publisher: Netherlands
LCC subjects: Technology: Mining engineering. Metallurgy
Website: https://www.journals.elsevier.com/journal-of-materials-research-and-technology/

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