Corrigendum to “Comparative study of solder wettability on aluminum substrate and microstructure-properties of Cu-based component/aluminum laser soldering joint” [Mater. Design 215 (2022) 110485]
Peng-Cheng Huan,
Xiao-Xia Tang,
Qian Sun,
Kato Akira,
Xiao-Nan Wang,
Jie Wang,
Jia-Le Wang,
Xia Wei,
Hong-Shuang Di
Affiliations
Peng-Cheng Huan
School of Iron and Steel, Soochow University, Suzhou, Jiangsu 215002, PR China; State Key Laboratory of Rolling and Automation, School of Materials Science and Engineering, Northeastern University, Shenyang, Liaoning 110819, PR China
Xiao-Xia Tang
MFLEX Yancheng Co., Ltd, Yancheng, Jiangsu 224000, PR China
Qian Sun
School of Iron and Steel, Soochow University, Suzhou, Jiangsu 215002, PR China; Corresponding authors.
Kato Akira
MFLEX Yancheng Co., Ltd, Yancheng, Jiangsu 224000, PR China
Xiao-Nan Wang
School of Iron and Steel, Soochow University, Suzhou, Jiangsu 215002, PR China; Corresponding authors.
Jie Wang
School of Iron and Steel, Soochow University, Suzhou, Jiangsu 215002, PR China
Jia-Le Wang
School of Iron and Steel, Soochow University, Suzhou, Jiangsu 215002, PR China
Xia Wei
School of Iron and Steel, Soochow University, Suzhou, Jiangsu 215002, PR China; State Key Laboratory of Rolling and Automation, School of Materials Science and Engineering, Northeastern University, Shenyang, Liaoning 110819, PR China
Hong-Shuang Di
State Key Laboratory of Rolling and Automation, School of Materials Science and Engineering, Northeastern University, Shenyang, Liaoning 110819, PR China
