Effect of mat moisture content and Cu nanoparticles on heat transfer and physical and mechanical properties of poplar particleboard

Abstract

Effects of mat moisture content (MC) and Cu nanoparticles on heat transfer and physical and mechanical properties of poplar particleboard were investigated. Three levels of mat moisture content (9, 12 and 15%. based on oven dried wood particles) and two levels of Cu nanoparticles (0 and 15% based on oven dried resin) were selected as variable factors. Results indicated that mechanical properties of particleboard improved as MC increases. Cu nanoparticles accelerated the heat transfer from the surface layer to the core layer of the mat and subsequently increased the internal bonding. This positive effect was evident as MC increased. Water absorption and thickness swelling increased as either MC or Cu nanoparticles content was raised. It was observed that the efficiency of Cu nanoparticles on heat transfer was superior at higher MC. Energy Dispersive X-Ray Spectroscopy (EDS) and Scanning Electron Microscopy (SEM) determination revealed that the presence and very well dispersion of Cu nanoparticles in glue line.

Keywords

• Poplar particleboard
• mat moisture content
• Cu nanoparticles
• Heat transfer
• PHYSICAL AND MECHANICAL PROPERTIES