Fabrication of MEMS-based 3D-μECoG-MEAs

Abstract

The microfabrication and packaging of novel, three-dimensional, polyimide-based, highly flexible, microscale electrocorticography multi-electrode arrays for enhanced epicortical recording of local field potentials is presented. A polyimide foil embeds metallic structures relating to 32 taper-type electrode sites, contact pads as well as interconnecting conductor paths which are integrated in the planar portion of the electrode substrate material. Circular exposed and, thus, active electrode sites are 50 μm in diameter and employed center-to-center pitches range from 250 μm to 1 mm, respectively. As-fabricated 3D-μECoG-MEAs provide taper heights of approximately 4 μm as well as 59 μm being distinguished by characteristic impedances of about 368.9 kΩ at 1 kHz measured in saline electrolyte. The applied packaging strategies favor flip-chip bonding and vapor phase soldering of the polymer substrates to customized printed circuit boards.

Keywords

• electrocorticography
• microelectrode
• polyimide
• snr
• three-dimensional