Nature Communications (Oct 2021)
Wafer-scale functional circuits based on two dimensional semiconductors with fabrication optimized by machine learning
- Xinyu Chen,
- Yufeng Xie,
- Yaochen Sheng,
- Hongwei Tang,
- Zeming Wang,
- Yu Wang,
- Yin Wang,
- Fuyou Liao,
- Jingyi Ma,
- Xiaojiao Guo,
- Ling Tong,
- Hanqi Liu,
- Hao Liu,
- Tianxiang Wu,
- Jiaxin Cao,
- Sitong Bu,
- Hui Shen,
- Fuyu Bai,
- Daming Huang,
- Jianan Deng,
- Antoine Riaud,
- Zihan Xu,
- Chenjian Wu,
- Shiwei Xing,
- Ye Lu,
- Shunli Ma,
- Zhengzong Sun,
- Zhongyin Xue,
- Zengfeng Di,
- Xiao Gong,
- David Wei Zhang,
- Peng Zhou,
- Jing Wan,
- Wenzhong Bao
Affiliations
- Xinyu Chen
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University
- Yufeng Xie
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University
- Yaochen Sheng
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University
- Hongwei Tang
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University
- Zeming Wang
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University
- Yu Wang
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University
- Yin Wang
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University
- Fuyou Liao
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University
- Jingyi Ma
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University
- Xiaojiao Guo
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University
- Ling Tong
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University
- Hanqi Liu
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University
- Hao Liu
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University
- Tianxiang Wu
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University
- Jiaxin Cao
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University
- Sitong Bu
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University
- Hui Shen
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University
- Fuyu Bai
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University
- Daming Huang
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University
- Jianan Deng
- State Key Laboratory of ASIC and System, School of Information Science and Technology, Fudan University
- Antoine Riaud
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University
- Zihan Xu
- Shenzhen Six Carbon Technology
- Chenjian Wu
- School of Electronic and Information Engineering, Soochow University
- Shiwei Xing
- School of Electronic and Information Engineering, Soochow University
- Ye Lu
- State Key Laboratory of ASIC and System, School of Information Science and Technology, Fudan University
- Shunli Ma
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University
- Zhengzong Sun
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University
- Zhongyin Xue
- State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
- Zengfeng Di
- State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
- Xiao Gong
- Department of Electrical and Computer Engineering, National University of Singapore
- David Wei Zhang
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University
- Peng Zhou
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University
- Jing Wan
- State Key Laboratory of ASIC and System, School of Information Science and Technology, Fudan University
- Wenzhong Bao
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University
- DOI
- https://doi.org/10.1038/s41467-021-26230-x
- Journal volume & issue
-
Vol. 12,
no. 1
pp. 1 – 8
Abstract
Here, the authors demonstrate the application of machine learning to optimize the device fabrication process for wafer-scale 2D semiconductors, and eventually fabricate digital, analog, and optoelectrical circuits.
