Thermal decomposition reaction kinetics and storage life prediction of polyacrylate pressure-sensitive adhesive

Abstract

The thermal decomposition behavior of polyacrylate pressure-sensitive adhesive (PSA) at heating rates of 4, 6, 8, and 10 K·min−1 was measured by thermogravimetric analysis (TGA). The kinetic parameters for thermal decomposition reaction of the polyacrylate adhesive were obtained from TG profile by differential method and integral method (Kissinger, general integral, MacCallum–Tanner, Šatava–Šesták, Agrawal, and Flynn–Wall–Ozawa), the results show that the main decomposition stage of the polyacrylate adhesive starts at 301°C and its activation energy is 142.68 kJ·mol−1, the pre exponential factor is 109.55, the decomposition mechanism obeys Avrami–Erofeev equation and its decomposition kinetic equation can be expressed as: dα/dT = (109.55/β)[(1 − α)/2][−ln(1 − α)]−1exp(−1.7161 × 104/T). The storage life of PSA at 25°C was predicted to be about 19 years by isoconversional method.

Keywords

• thermal decomposition
• polyacrylate
• pressure-sensitive adhesive
• non-isothermal reaction kinetics
• storage life