Adhesion property between low-thermal-expansion poly(benzoxazole-imide) film and ion-implanted copper

Abstract

Surface modification of poly(benzoxazole-imide) (PI) film was carried out by means of oxygen plasma treatment. A flexible copper clad laminate (FCCL) was fabricated using Ni-Cr ion implantation and electro-Cu plating process. Controlling the constant pressure, the effects of such treatment conditions as power and time were systematically investigated on the surface roughness, chemical composition and interface adhesion with Cu. It is found that the optical parameters for production of FCCL with excellent adhesion and solder resistance are 50 W/5 min and 100 W/10 min, respectively. Suitable roughness, reactive radical with high content pendent oxygen group, and metal-oxazole complex help to endow exceptional adhesive property to the interface of PI/Cu. And the peel strength of FCCL prepared from PI film with such modified surface rises by 60%.

Keywords

• benzoxazole
• polyimide
• ion implantation
• flexible cupper clad laminate
• peel strength