Feasibility Analysis of Using X-ray Inspection Systems for Assessing the Mass Thickness of Integrated Circuit Packages

Abstract

This paper analyzes the feasibility of using a standard X-ray inspection setup to assess the mass thickness of integrated circuit packages. Such assessments are necessary for accurately determining the values of ion linear energy transfer during experimental studies on high-energy ion accelerators involving encapsulated microelectronic products. Preliminary results demonstrating this possibility are presented. The design and operational characteristics of the X-ray inspection system are discussed, revealing that the results of the assessments are significantly influenced by the instability of the X-ray unit's characteristics, the divergence of the X-ray radiation, and the accuracy of the positioning of the integrated circuits. A method for evaluating the mass thickness of packages is justified, utilizing simultaneous irradiation of a wedge made of a known material alongside the sample under investigation. To minimize the impact of dimensional effects, trimming part of the package is permitted when feasible.

Keywords

• information systems security, mass thickness, integrated circuit packages, x-ray inspection system, nica nuclotron.