Antioxidant high-conductivity copper paste for low-cost flexible printed electronics

Shuqing Hong; Chimin Liu; Shuqiang Hao; Wenxing Fu; Jian Peng; Binghui Wu; Nanfeng Zheng

doi:10.1038/s41528-022-00151-1

npj Flexible Electronics (Mar 2022)

Antioxidant high-conductivity copper paste for low-cost flexible printed electronics

Shuqing Hong,
Chimin Liu,
Shuqiang Hao,
Wenxing Fu,
Jian Peng,
Binghui Wu,
Nanfeng Zheng

Affiliations

Shuqing Hong: Pen-Tung Sah Institute of Micro-Nano Science and Technology, State Key Laboratory for Physical Chemistry of Solid Surfaces, Collaborative Innovation Center of Chemistry for Energy Materials, National & Local Joint Engineering Research Center of Preparation Technology of Nanomaterials, College of Chemistry and Chemical Engineering, Xiamen University
Chimin Liu: Pen-Tung Sah Institute of Micro-Nano Science and Technology, State Key Laboratory for Physical Chemistry of Solid Surfaces, Collaborative Innovation Center of Chemistry for Energy Materials, National & Local Joint Engineering Research Center of Preparation Technology of Nanomaterials, College of Chemistry and Chemical Engineering, Xiamen University
Shuqiang Hao: Pen-Tung Sah Institute of Micro-Nano Science and Technology, State Key Laboratory for Physical Chemistry of Solid Surfaces, Collaborative Innovation Center of Chemistry for Energy Materials, National & Local Joint Engineering Research Center of Preparation Technology of Nanomaterials, College of Chemistry and Chemical Engineering, Xiamen University
Wenxing Fu: Innovation Laboratory for Sciences and Technologies of Energy Materials of Fujian Province (IKKEM)
Jian Peng: Pen-Tung Sah Institute of Micro-Nano Science and Technology, State Key Laboratory for Physical Chemistry of Solid Surfaces, Collaborative Innovation Center of Chemistry for Energy Materials, National & Local Joint Engineering Research Center of Preparation Technology of Nanomaterials, College of Chemistry and Chemical Engineering, Xiamen University
Binghui Wu: Pen-Tung Sah Institute of Micro-Nano Science and Technology, State Key Laboratory for Physical Chemistry of Solid Surfaces, Collaborative Innovation Center of Chemistry for Energy Materials, National & Local Joint Engineering Research Center of Preparation Technology of Nanomaterials, College of Chemistry and Chemical Engineering, Xiamen University
Nanfeng Zheng: Pen-Tung Sah Institute of Micro-Nano Science and Technology, State Key Laboratory for Physical Chemistry of Solid Surfaces, Collaborative Innovation Center of Chemistry for Energy Materials, National & Local Joint Engineering Research Center of Preparation Technology of Nanomaterials, College of Chemistry and Chemical Engineering, Xiamen University

DOI: https://doi.org/10.1038/s41528-022-00151-1
Journal volume & issue: Vol. 6, no. 1
pp. 1 – 9

Abstract

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Abstract The flexible printed electronics (e.g., wearable devices, roll-up displays, heating circuits, radio frequency identification (RFID) tags) calls for high-conductivity and low-cost materials, particularly for copper pastes. It is still a big challenge to develop reliable copper pastes for both antioxidant and high-conductivity flexible printed films and lines. In this work, an antioxidant copper paste was achieved using copper microflakes with surface passivation by formate ions and thiols, with high conductivity of 13400 S cm−1 (the same order of magnitude of silver pastes, 1.8–2.5 × 104 S cm−1). The universal applications of as-prepared copper paste in flexible printed electronics (e.g., electromagnetic interference (EMI) shielding films, anti-fog films, and RFID tags) via screen printing and curing at 170 °C under ambient atmosphere were demonstrated. The as-printed electronics showed high performance in flexibility, stability, and reliability. This work shows the great potential of anti-oxidation copper pastes in low-cost flexible printed electronics for commercial usage.

Published in npj Flexible Electronics

ISSN: 2397-4621 (Online)
Publisher: Nature Portfolio
Country of publisher: United Kingdom
LCC subjects: Technology: Electrical engineering. Electronics. Nuclear engineering: Electronics; Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
Website: https://www.nature.com/npjflexelectron/

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