Materials (Nov 2022)

A Promising High-Entropy Thermal Barrier Material with the Formula (Y<sub>0.2</sub>Dy<sub>0.2</sub>Ho<sub>0.2</sub>Er<sub>0.2</sub>Yb<sub>0.2</sub>)<sub>3</sub>Al<sub>5</sub>O<sub>12</sub>

  • Zhanqiang Li,
  • Junfeng Zheng,
  • Wenjuan Zhang,
  • Yong Zheng,
  • Weijun Zhao,
  • Liyan Xue,
  • Fan Yang,
  • Heng Chen

DOI
https://doi.org/10.3390/ma15228079
Journal volume & issue
Vol. 15, no. 22
p. 8079

Abstract

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YSZ has been widely used as a TBC material, but its phase change at high temperatures limits its development, thus the need for developing new thermal barrier materials resistant to high temperatures. Rare-earth aluminate ceramics with a garnet structure (Yb3Al5O12) have been considered as a potential thermal barrier material. The melting point of Yb3Al5O12 is 2000 °C, which has a potential high temperature application prospect. However, Yb3Al5O12 has lower thermal expansion and higher thermal conductivity than YSZ, which is a widely employed thermal barrier coating (TBC) material. To overcome these obstacles, (Y0.2Dy0.2Ho0.2Er0.2Yb0.2)3Al5O12, a high-entropy ceramic, was prepared by a solid-state reaction and pressureless sintering. The thermal conductivity of the (Y0.2Dy0.2Ho0.2Er0.2Yb0.2)3Al5O12 was 3.48 W/(m·K) at 300 K, approximately 25.48% lower than that of the Yb3Al5O12 (4.67 W/(m·K)). The thermal expansion coefficient of the (Y0.2Dy0.2Ho0.2Er0.2Yb0.2)3Al5O12 was 9.28 × 10−6 K−1 at 673-1273 K, approximately 18.52% higher than that of the Yb3Al5O12 (7.83 × 10−6 K−1, 673-1273 K). When the (Y0.2Dy0.2Ho0.2Er0.2Yb0.2)3Al5O12 was annealed at 1550 °C for 7 days, its average grain size only increased from 0.7 μm to 1.3 μm. Moreover, the (Y0.2Dy0.2Ho0.2Er0.2Yb0.2)3Al5O12 exhibited better chemical stability and a lower grain growth rate than the Yb3Al5O12. This study reveals that (Y0.2Dy0.2Ho0.2Er0.2Yb0.2)3Al5O12 is a promising candidate for the future generation of thermal barrier materials.

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