Copper nanoparticle-coated suture: A novel antimicrobial agent

Abstract

Introduction: As a new emerging nanotechnology approach, copper nanoparticles (CuNPs) coated on traditional silk suture were used. Its antimicrobial and anti-inflammatory properties, led to its increasing medical applications. Commercially available as wound dressings, surgical instruments and bone prostheses. Objectives: To compare physical parameters of nano-copper and silk suture. Methodology: Copper nanoparticles and deionized water were adopted for the preparation of the copper solution. The copper solution was obtained by dissolving 0.5 wt/v % of copper nanoparticles in a mixture of 5 v/v % of deionized water. The silk suture were dipped in the copper solution for 24 hr and then exposed to UV lamp in order to induce the synthesis of copper clusters on the surface of the suture. Inverted electron microscopy was performed in order to analyse the braided structure of the multifilament silk sutures and to verify the presence of copper on the surface. A quantitative spectrophotometry analysis was performed to quantify the percentage of copper deposited. Tensile strength was measured by Universal Testing Machine. Results: Nano-copper suture showed enhanced physical parameters as compared to silk suture. Conclusion: Copper nanoparticles due to their beneficial effects as antibacterial and wound healing accelerator in the periodontal surgeries could reduce inflammation and promote healing process.

Keywords

• copper nanoparticles
• cunps
• nano-copper-coated silk suture
• silk suture