Thermal Performance Study of Plate-finned Vapor Chamber Heat Sink

Abstract

This study focuses on improving the thermal characteristics of a plate-finned heat sink (PFHS) by incorporating a vapor chamber (VC) through experimental investigation. The research examines the influence of various parameters, including Reynolds number (Re), heat input, filling ratio (FR), and operating vacuum pressure, on the thermal performance of the VC. The results demonstrate that the utilization of a VC leads to a significantly more uniform temperature distribution along the base of the PFHS and low overall temperatures. Conversely, in the absence of a VC, the PFHS exhibits a non-uniform temperature distribution, with a bell-shaped profile and concentrated high temperatures at the center at the same operating conditions. The results indicate that an operating vacuum pressure of 1kPa produces the most favorable performance. Additionally, a filling ratio of 50% proves to be optimal across the range of heat inputs from 10 to 90 W.

Keywords

• heat sink
• vapor chamber
• thermal resistance
• electronic devices cooling