Micromachines (Jun 2014)

Wafer-Level Hybrid Integration of Complex Micro-Optical Modules

  • Peter Dannberg,
  • Frank Wippermann,
  • Andreas Brückner,
  • Andre Matthes,
  • Peter Schreiber,
  • Andreas Bräuer

DOI
https://doi.org/10.3390/mi5020325
Journal volume & issue
Vol. 5, no. 2
pp. 325 – 340

Abstract

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A series of technological steps concentrating around photolithography and UV polymer on glass replication in a mask-aligner that allow for the cost-effective generation of rather complex micro-optical systems on the wafer level are discussed. In this approach, optical functional surfaces are aligned to each other and stacked on top of each other at a desired axial distance. They can consist of lenses, achromatic doublets, regular or chirped lens arrays, diffractive elements, apertures, filter structures, reflecting layers, polarizers, etc. The suitability of the separated modules in certain imaging and non-imaging applications will be shown.

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