Effects of Reflow Time on the Interfacial Microstructure and Shear Behavior of the SAC/FeNi-Cu Joint

Yunxia Chen; Xulei Wu; Xiaojing Wang; Hai Huang

doi:10.3390/met6050109

Metals (May 2016)

Effects of Reflow Time on the Interfacial Microstructure and Shear Behavior of the SAC/FeNi-Cu Joint

Yunxia Chen,
Xulei Wu,
Xiaojing Wang,
Hai Huang

Affiliations

Yunxia Chen: School of Mechanical and Electrical Engineering, Shanghai Dianji University, Shanghai 201306, China
Xulei Wu: School of Material and Science Engineering, Jiangsu University of Science and Technology, Zhenjiang 212003, China
Xiaojing Wang: School of Material and Science Engineering, Jiangsu University of Science and Technology, Zhenjiang 212003, China
Hai Huang: School of Material and Science Engineering, Jiangsu University of Science and Technology, Zhenjiang 212003, China

DOI: https://doi.org/10.3390/met6050109
Journal volume & issue: Vol. 6, no. 5
p. 109

Abstract

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Effects of reflow time on the interfacial microstructure and shear strength of the SAC/FeNi-Cu connections were investigated. It was found that the amount of Cu6Sn5 within the solder did not have a noticeable increase after a long time period of reflowing, indicating that the electro-deposited FeNi layer blocked the Cu atoms effectively into the solder area during a long period under liquid-conditions. The ball shear test results showed that the SAC/FeNi-Cu joint had a comparable strength to the SAC/Cu joint after reflowing, and the strength drop after reflowing for 210 s was less than that of the SAC/Cu joint.

Published in Metals

ISSN: 2075-4701 (Online)
Publisher: MDPI AG
Country of publisher: Switzerland
LCC subjects: Technology: Mining engineering. Metallurgy
Website: http://www.mdpi.com/journal/metals

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