Influence of microstructure and internal stress on the mechanical behavior of electroplated gold freestanding thin films

Abstract

Mechanical properties of freestanding electroplated gold thin films were studied in relationship to their geometrical and microstructural properties. Three different techniques of characterization were used: nanoindentation, bulge tests and microtensile tests. Results were compared to literature and also discussed according to physical phenomena related to the elaboration process of the specimens like seed layer exodiffusion or internal stress state. The observed plasticity and failure mechanisms were found to be in good agreement with the literature and are consistent with the microstructure. The measured Young’s modulus is slightly higher than expected, and SIMS analysis is exploited to explain such a high value.