Dynamics of crevice microbubbles that cause the twinkling artifact

Abstract

The Doppler ultrasound twinkling artifact, a rapid color shift, appears on pathological mineralizations and is theorized to arise from scattering off micron-sized crevice microbubbles. However, the influence of crevice number and size as well as the bubble dynamics on twinkling is not well-understood. Cylinders with diameters of 0.8–1.2 µm and depths of 1 µm were etched into a silicon wafer and crevice bubbles were driven at 0.75, 2.5, and 5.0 MHz while monitoring with high-speed photography. Experimental results were compared to a derived crevice bubble model. On three separate wafers, cylindrical crevices (10 or 100) with diameters of 1, 10, or 100 µm and depths of 10 µm were etched and imaged with a research ultrasound system in Doppler mode at 5, 7.8, and 18.5 MHz. Within the pressure ranges studied here (∼1 MPa), no bubble oscillation was observed for the 0.8–1.2 µm crevice bubbles which matched computational results. Crevices with 1 and 10 µm diameters produced more twinkling than 100 µm crevices at 5 and 7.8 MHz. In contrast, 100 µm crevices produced more twinkling than 1 or 10 µm crevices at 18.5 MHz (p < 0.001 in all cases). These results provide better insight into how crevice bubbles cause twinkling on pathological mineralizations.

Keywords

• Microbubbles
• Twinkling artifact
• Silicon
• Cavitation