Cailiao gongcheng (Jan 2019)

Densification and properties of Mo-Cu composite powders

  • SUN Ao-kui,
  • LIU Yue-jun,
  • CHEN Qing-rou

DOI
https://doi.org/10.11868/j.issn.1001-4381.2018.000451
Journal volume & issue
Vol. 47, no. 1
pp. 112 – 118

Abstract

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The Mo-Cu nano-powders were synthesized by a microwave-assisted aqueous solution strategy and subsequent low-temperature hydrogen reduction process. The sintering densification behavior of Mo-Cu composite powders and the sintering properties of the composite compacts were investigated. Results show that the sintering temperature is a critical factor in the densification process of Mo-Cu composites. The shrinkage rate, density and hardness of sintered composites increase as the temperature rises. However, too high sintering temperature causes significant loss of copper phase and abnormal grain growth, resulting in decrease in density, hardness, electrical conductivity and thermal conductivity. By optimizing all the performance indicators, high performance Mo-25%Cu composites with homogeneous microstructure accompanied with good physical and mechanical properties can be obtained by sintering for 2h at 1100℃, for the actual chemical composition is highly close to the designed chemical composition. The density, hardness, bending strength, electrical conductivity and thermal conductivity are 9.79g/cm3, 229.1HV, 837.76MPa, 24.97×106S·m-1 and 176.57W·m-1·K-1, respectively.

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