A universal method for depositing patterned materials in situ

Yifan Chen; Siu Fai Hung; Wing Ki Lo; Yang Chen; Yang Shen; Kim Kafenda; Jia Su; Kangwei Xia; Sen Yang

doi:10.1038/s41467-020-19210-0

Nature Communications (Oct 2020)

A universal method for depositing patterned materials in situ

Yifan Chen,
Siu Fai Hung,
Wing Ki Lo,
Yang Chen,
Yang Shen,
Kim Kafenda,
Jia Su,
Kangwei Xia,
Sen Yang

Affiliations

Yifan Chen: Department of Physics, The Chinese University of Hong Kong, Shatin
Siu Fai Hung: Department of Physics, The Chinese University of Hong Kong, Shatin
Wing Ki Lo: Department of Physics, The Chinese University of Hong Kong, Shatin
Yang Chen: Department of Physics, The Chinese University of Hong Kong, Shatin
Yang Shen: Department of Physics, The Chinese University of Hong Kong, Shatin
Kim Kafenda: Department of Physics, The Chinese University of Hong Kong, Shatin
Jia Su: Department of Biology, South University of Science and Technology of China
Kangwei Xia: Department of Physics, The Chinese University of Hong Kong, Shatin
Sen Yang: Department of Physics, The Chinese University of Hong Kong, Shatin

DOI: https://doi.org/10.1038/s41467-020-19210-0
Journal volume & issue: Vol. 11, no. 1
pp. 1 – 8

Abstract

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Complexity and harsh working conditions pose limitations for fabrication of patterned materials. Here the authors report a single-step method for in situ deposition of materials that is based on semiconductor nanoparticle assisted photon-induced chemical reduction and optical trapping.

Published in Nature Communications

ISSN: 2041-1723 (Online)
Publisher: Nature Portfolio
Country of publisher: United Kingdom
LCC subjects: Science
Website: https://www.nature.com/ncomms/

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