Effect of the variable electrical conductivity on the thermal stability of the MHD reactive squeezed fluid flow through a channel by a spectral collocation approach

Abstract

The present work discusses the impact of the variable electrical conductivity on the thermal stability of the exothermic MHD reactive squeezed fluid flow through parallel plates. The governing nonlinear partial differential equations of the problem are remodel into ordinary differential equations and are solved using spectral collocation method. The obtained results are validated with those obtained using Runge–Kutta fourth–fifth order numerical algorithm (RK45) coupled with a shooting technique, and an excellent agreement is found. The impacts of emerging kinetic parameters, such as the activation energy, the reaction rate, the electrical conductivity exponent and the squeezed number, on the temperature profiles and thermal stability of the system are presented and discussed. It is revealed that positive squeezed number tends to delay the blow-up of the system, while both the negative squeezed number and the electrical conductivity exponent hasten thermal instability of the system.

Keywords

• Variable electrical conductivity
• Thermal stability
• SCM
• Reactive fluid
• MHD