Thermal cooling system with Ag/Fe3O4 nanofluids mixture as coolant for electronic devices cooling

Abstract

The thermal dissipation resistance has encountered a problem in the thermal analysis of the electronic components. Due to the limitation of the coolant heat removal capacity, the nanofluid and flow feature of the coolant flowing through the thermal cooling system have proposed. The mixture of Ag and Fe3O4 nanoparticles and flow direction guide vane of coolant for cooling electronic devices have been investigated. The effects of coolant flow rate, coolant type, and heat sink configuration on the thermal dissipation efficiency are considered. Ag and Fe3O4 nanoparticles suspending in the base fluid test and compared with the de-ionized water. The obtained results found that the proposed water blocks have a significant effect on the flow feature of coolant flowing through the thermal cooling system, which results in 11.94% increase in thermal dissipation efficiency. Besides, the thermal dissipation efficiency from Ag/Fe3O4 nanofluid mixture as the coolant is higher than Ag nanofluids and higher than that de-ionized water as the coolant, respectively.

Keywords

• Nanofluids mixture
• Thermal dissipation efficiency
• Electronic devices