STAR Protocols (Mar 2022)

Protocol on the fabrication of monocrystalline thin semiconductor via crack-assisted layer exfoliation technique for photoelectrochemical water-splitting

  • Yonghwan Lee,
  • Bikesh Gupta,
  • Hark H. Tan,
  • Chennupati Jagadish,
  • Jihun Oh,
  • Siva Karuturi

Journal volume & issue
Vol. 3, no. 1
p. 101015

Abstract

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Summary: Thin semiconductors attract huge interest due to their cost-effective, flexible, lightweight, and semi-transparent properties. Here, we present a protocol on the preparation of thin semiconductor via controlled crack-assisted layer exfoliation technique. The protocol details the fabrication procedure for producing thin monocrystalline semiconductors with thicknesses in the range of a few tens of micrometers from thick donor substrates. In addition, we describe proof-of-concept application of the thin semiconductors for photoelectrochemical water-splitting to produce hydrogen fuel.For complete details on the use and execution of this protocol, please refer to Lee et al. (2021).

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