MATEC Web of Conferences (Jan 2018)

Cooling Performance of Heat Sinks Used in Electronic Devices

  • Mjallal Ibrahim,
  • Farhat Hussein,
  • Hammoud Mohammad,
  • Ali Samer,
  • AL Shaer Ali,
  • Assi Ali

DOI
https://doi.org/10.1051/matecconf/201817102003
Journal volume & issue
Vol. 171
p. 02003

Abstract

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Existing passive cooling solutions limit the short-term thermal output of systems, thereby either limiting instantaneous performance or requiring active cooling solutions. As the temperature of the electronic devices increases, their failure rate increases. That’s why electrical devices should be cooled. Conventional electronic cooling systems usually consist of a metal heat sink coupled to a fan. This paper compares the heat distribution on a heat sink relative to different heat fluxes produced by electronic chips. The benefit of adding a fan is also investigated when high levels of heat generation are expected.

Keywords