Simulation and Optimization of Assembly Structure of Thermoelectric Refrigeration Box Based on SolidWorks Flow Simulation

Abstract

In order to improve the refrigeration performance of thermoelectric refrigeration box, the common thermoelectric (semiconductor) refrigeration box on the market was analyzed, and the structure between the refrigeration assembly of the refrigeration box and the wall of the box was explored. SolidWorks Flow Simulation was used to model and simulate the structure between the refrigeration assembly and the wall of the refrigeration box. The effects of gravity, fan direction, groove size and bracket on the refrigeration performance of semiconductor refrigeration box were analyzed. It is concluded that when the groove size is fixed, the cooling performance of thermoelectric refrigeration box is optimal when the gravity direction is at the longest side of the box size, the direction of fan intake is suction and symmetrical bracket is added in the groove. The four sides of the support are cut out as many circles as possible, and the larger the circle is, the better.

Keywords

• thermoelectric refrigeration box
• solid-works flow simulation
• installation framework
• optimal analysis