Micromachines (Jul 2023)

Built-In Packaging for Two-Terminal Devices

  • Ahmet Gulsaran,
  • Bersu Bastug Azer,
  • Dogu Ozyigit,
  • Resul Saritas,
  • Samed Kocer,
  • Eihab Abdel-Rahman,
  • Mustafa Yavuz

DOI
https://doi.org/10.3390/mi14071473
Journal volume & issue
Vol. 14, no. 7
p. 1473

Abstract

Read online

Conventional packaging and interconnection methods for two-terminal devices, e.g., diodes often involve expensive and bulky equipment, introduce parasitic effects and have reliability issues. In this study, we propose a built-in packaging method and evaluate its performance compared to probing and wire bonding methods. The built-in packaging approach offers a larger overlap area, improved contact resistance, and direct connection to testing equipment. The experimental results demonstrate a 12% increase in current, an 11% reduction in resistance, and improved performance of the diode. The proposed method is promising for enhancing sensing applications, wireless power transmission, energy harvesting, and solar rectennas. Overall, the built-in packaging method offers a simpler, cheaper, more compact and more reliable packaging solution, paving the way for more efficient and advanced technologies in these domains.

Keywords