Three-Dimensional Heterostructured Reduced Graphene Oxide-Hexagonal Boron Nitride-Stacking Material for Silicone Thermal Grease with Enhanced Thermally Conductive Properties

Weijie Liang; Xin Ge; Jianfang Ge; Tiehu Li; Tingkai Zhao; Xunjun Chen; Mingchang Zhang; Jianye Ji; Xiaoyan Pang; Ruoling Liu

doi:10.3390/nano9070938

Nanomaterials (Jun 2019)

Three-Dimensional Heterostructured Reduced Graphene Oxide-Hexagonal Boron Nitride-Stacking Material for Silicone Thermal Grease with Enhanced Thermally Conductive Properties

Weijie Liang,
Xin Ge,
Jianfang Ge,
Tiehu Li,
Tingkai Zhao,
Xunjun Chen,
Mingchang Zhang,
Jianye Ji,
Xiaoyan Pang,
Ruoling Liu

Affiliations

Weijie Liang: Shaanxi Engineering Laboratory of Graphene New Carbon Materials and Applications, School of Materials Science and Engineering, Northwestern Polytechnical University, Xi’an 710072, China
Xin Ge: Guangdong Engineering Research Center of Silicone Electronic Fine Chemicals, College of Chemistry and Chemical Engineering, Zhongkai University of Agriculture and Engineering, Guangzhou 510225, China
Jianfang Ge: Guangdong Engineering Research Center of Silicone Electronic Fine Chemicals, College of Chemistry and Chemical Engineering, Zhongkai University of Agriculture and Engineering, Guangzhou 510225, China
Tiehu Li: Shaanxi Engineering Laboratory of Graphene New Carbon Materials and Applications, School of Materials Science and Engineering, Northwestern Polytechnical University, Xi’an 710072, China
Tingkai Zhao: Shaanxi Engineering Laboratory of Graphene New Carbon Materials and Applications, School of Materials Science and Engineering, Northwestern Polytechnical University, Xi’an 710072, China
Xunjun Chen: Guangdong Engineering Research Center of Silicone Electronic Fine Chemicals, College of Chemistry and Chemical Engineering, Zhongkai University of Agriculture and Engineering, Guangzhou 510225, China
Mingchang Zhang: Shaanxi Engineering Laboratory of Graphene New Carbon Materials and Applications, School of Materials Science and Engineering, Northwestern Polytechnical University, Xi’an 710072, China
Jianye Ji: Guangdong Engineering Research Center of Silicone Electronic Fine Chemicals, College of Chemistry and Chemical Engineering, Zhongkai University of Agriculture and Engineering, Guangzhou 510225, China
Xiaoyan Pang: Guangdong Engineering Research Center of Silicone Electronic Fine Chemicals, College of Chemistry and Chemical Engineering, Zhongkai University of Agriculture and Engineering, Guangzhou 510225, China
Ruoling Liu: Guangdong Engineering Research Center of Silicone Electronic Fine Chemicals, College of Chemistry and Chemical Engineering, Zhongkai University of Agriculture and Engineering, Guangzhou 510225, China

DOI: https://doi.org/10.3390/nano9070938
Journal volume & issue: Vol. 9, no. 7
p. 938

Abstract

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The thermally conductive properties of silicone thermal grease enhanced by hexagonal boron nitride (hBN) nanosheets as a filler are relevant to the field of lightweight polymer-based thermal interface materials. However, the enhancements are restricted by the amount of hBN nanosheets added, owing to a dramatic increase in the viscosity of silicone thermal grease. To this end, a rational structural design of the filler is needed to ensure the viable development of the composite material. Using reduced graphene oxide (RGO) as substrate, three-dimensional (3D) heterostructured reduced graphene oxide-hexagonal boron nitride (RGO-hBN)-stacking material was constructed by self-assembly of hBN nanosheets on the surface of RGO with the assistance of binder for silicone thermal grease. Compared with hBN nanosheets, 3D RGO-hBN more effectively improves the thermally conductive properties of silicone thermal grease, which is attributed to the introduction of graphene and its phonon-matching structural characteristics. RGO-hBN/silicone thermal grease with lower viscosity exhibits higher thermal conductivity, lower thermal resistance and better thermal management capability than those of hBN/silicone thermal grease at the same filler content. It is feasible to develop polymer-based thermal interface materials with good thermal transport performance for heat removal of modern electronics utilising graphene-supported hBN as the filler at low loading levels.

Published in Nanomaterials

ISSN: 2079-4991 (Online)
Publisher: MDPI AG
Country of publisher: Switzerland
LCC subjects: Science: Chemistry
Website: https://www.mdpi.com/journal/nanomaterials

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