Advanced Electronic Materials (Jul 2023)

Enhanced Stretchability of Wavy‐Structured Thermally Grown Silicon Dioxide Films for Stretchable Encapsulation

  • Hangeul Kim,
  • Gyeong‐Seok Hwang,
  • Sukbin Lee,
  • Ju‐Young Kim

DOI
https://doi.org/10.1002/aelm.202300078
Journal volume & issue
Vol. 9, no. 7
pp. n/a – n/a

Abstract

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Abstract Aligned wavy‐structured thermally grown silicon dioxide films are fabricated for stretchable encapsulation films. Uniaxial stretchability is investigated with micromechanics modeling, which can elucidate the stretchability arising from the wavy structure and the properties of the materials. The wavy‐structured films with optimum combinations of film thickness and wavy structure show 20.1% of uniaxial stretchability and 1.11 × 10−6 g m−2 day−1 of water vapor transmission rate (WVTR), simultaneously. It shows highly reliable barrier properties even after 1000 stretching cycles at 90% of their stretchability.

Keywords