Advanced Electronic Materials (Oct 2024)

Characteristics of MAPbI3 Stacked on the GaN Nanowires‐On‐Glass

  • Kwang Jae Lee,
  • Yeong Jae Kim,
  • Jung‐Hong Min,
  • Chun Hong Kang,
  • Ram Chandra Subedi,
  • Huafan Zhang,
  • Latifah Al‐Maghrabi,
  • Kwangwook Park,
  • Dante Ahn,
  • Yusin Pak,
  • Tien Khee Ng,
  • Young Min Song,
  • Boon S. Ooi,
  • Osman M. Bakr,
  • Jungwook Min

DOI
https://doi.org/10.1002/aelm.202400095
Journal volume & issue
Vol. 10, no. 10
pp. n/a – n/a

Abstract

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Abstract When implementing optoelectronic devices through the stacking of heterogeneous materials, considering the bandgap offset is crucial for achieving efficient carrier dynamics. In this study, the bandgap offset characteristics are investigated when n‐type gallium nitride nanowires (n‐GaN NWs) are used as electron transport layers in methylammonium lead iodide (MAPbI3)‐based optoelectronic devices. n‐GaN NWs are grown on indium‐tin‐oxide (ITO)‐coated glass via the plasma‐assisted molecular beam epitaxy (PA‐MBE) process to form the “GaN NWs‐on‐glass” platform. A MAPbI3 thin film is then spin‐coated on the GaN NWs‐on‐glass. X‐ray photoelectron spectroscopy (XPS) shows that the valence and conduction band offsets in the MAPbI3/n‐GaN heterostructure are 2.19 and 0.40 eV, respectively, indicating a type‐II band alignment ideal for optoelectronic applications. Prototype photovoltaic devices stacking perovskite on GaN NWs‐on‐glass show excellent interfacial charge‐transfer ability, photon recycling, and carrier extraction efficiency. As a pioneering step in exploiting the diverse potential of the GaN‐on‐glass, it is demonstrated that the junction characteristics of MAPbI3/n‐GaN NW heterostructures can lead to a variety of optoelectronic device applications.

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