Optimization of fin layout in liquid-cooled microchannels for multi-core chips

Abstract

When the dense pin-fins array distributed uniformly is used to dissipate the non-uniform heat source, it is easy to generate excessive cooling at the non-hot spot, which leads to unnecessary heat dissipation loss. In this study, a three-dimensional model of a multi-core chip-microchannel heat sink is established. Fin layout in the chip-microchannel is optimized under the conditions of non-uniform power-partition chip based on constructal theory. The total volume of fins in a channel is selected as the constraint condition. A genetic algorithm is used to seek the optimal construct. Comparing the optimal fin layout with the dense pin-fins array, the results demonstrate that the maximum temperature can be reduced by 6.75 K when Re number is 750, and the total pressure loss can be reduced by 54.1% when Re number is 750. Namely, under the condition of non-uniform heat source, the fins with a certain total volume were distributed reasonably, which can maintain the optimal balance of heat dissipation capacity and heat dissipation cost, so that the accurate and efficient thermal design is realized, and the better comprehensive benefits are obtained.

Keywords

• Constructal theory
• Fin layout
• Multi-chip module
• Microchannels
• Thermal reliability