PDN design optimization of micro-system based on package

Abstract

As the power supply of IC chips tends to be low-voltage and high-current, the design of the Power Delivery Network(PDN) of the micro-system module is becoming more and more important, based on 2.5D Through-Silicon-Via(TSV), inverted solder, High Temperature Co-fired Ceramics(HTCC),3D stacking, etc. Chip currents generate output noise through PDN interconnects, which must provide a better signal return path with low-impedance to keep the supply voltage between chip pads constant within a small tolerance range, usually 5% or less. Based on Chip Package System(CPS), the paper proposes a design and optimization method for the micro-system module PDN based on the three-level synergy of TSV silicon substrate, HTCC cases and PCB. This paper expounds the DC design and AC impedance design respectively, and using the Chip Power Model(CPM) combined with the time domain analysis, realizes the low impedance design of the power ripple on PDN.

Keywords

• tsv
• htcc
• micro-system
• pdn
• package