AIP Advances (Jan 2018)

Pattern transition from dense branching morphology to fractal for copper and β′ brass electrodeposition in thin gap geometry

  • Raveena Gupta,
  • Souradeep Ghosh,
  • Soumi Choudhury,
  • Subhankar Ghosh

DOI
https://doi.org/10.1063/1.5007110
Journal volume & issue
Vol. 8, no. 1
pp. 015219 – 015219-9

Abstract

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Copper and β′ brass are electrodeposited in thin gap geometry and a clear transition from dense branching to fractal like pattern is observed with the variation of electric potential and concentration. The transition electric potential is 6V – 5V for copper and 25V for β′ brass. The explanation of the pattern transition is done first using the Laplacian growth as in the Di-electric Breakdown Model (DBM) and then on the basis of ion dynamics in terms of viscosity, ionic mobility, drift and thermal velocity. The fractal growth is more likely at higher electric potential as the electric field dominates and more likely to be dense branched at lower electric field when thermal motion dominates. This work inspires for further studies on modification of our model for the two ions electrodeposition and their compositional variation with different deposition parameters.