Journal of Materials Research and Technology (Sep 2023)
Hot deformation behavior and resultant microstructural evolution of dilute Mg–Bi–Sn–Mn alloy during hot compression
Abstract
This study investigated the dynamic recrystallization (DRX) mechanism and hot-deformation behavior of the solution-treated Mg-0.5Bi-0.5Sn-0.5Mn (BTM000) alloy during hot compression at temperatures ranging from 175 to 225 °C with a strain rate of 0.001–1 s−1. Processing maps and constitutive equation were used for a detailed analysis. The results showed a strong correlation with a coefficient of 0.987669, indicating the accuracy of proposed method in predicting the hot deformation behavior. The average activation energy (Q) was found to be 139.10 kJ/mol, and the stress component (n) was calculated to be 7.96, suggesting that cross-slip is the primary deformation mechanism. Based on the processing maps, the most suitable processing conditions were found to be within the range of 210–290 °C with a strain rate of 0.37–1 s−1. At a low strain rate of 0.001 s−1, the dominant deformation mechanism observed was pyramidal slip. However, at higher temperatures (175–325 °C) and a strain rate of 1 s−1, a transformation from basal slip to a combination of basal slip and pyramidal slip was observed. Under low-temperature and low-strain-rate conditions (175 °C/0.001 s−1), continuous dynamic recrystallization (CDRX) was the dominant mechanism. In contrast, under other deformation conditions (175 °C/1 s−1, 325 °C/0.001 s−1, 325 °C/1 s−1), a synergistic effect between discontinuous dynamic recrystallization (DDRX) and CDRX was evident. Through quasi-situ kernel average misorientation (KAM) characterization, it was observed that the local storage energy associated with CDRX was significantly lower compared to the combination of CDRX and DDRX, indicating a higher likelihood of CDRX occurrence.