Investigation Of Intermetallic Compounds In Sn-Cu-Ni Lead-Free Solders

Abstract

Interfacial intermetallic compounds (IMC) play an important role in Sn-Cu lead-free soldering. The size and morphology of the intermetallic compounds formed between the lead-free solder and the Cu substrate have a significant effect on the mechanical strength of the solder joint.

Keywords

• intermetallics
• lead-free solder
• X-ray diffraction