Localized Surface Hydrophilicity Tailoring of Polyimide Film for Flexible Electronics Manufacturing Using an Atmospheric Pressure Ar/H₂O Microplasma Jet

Abstract

The poor hydrophilicity of polyimide (PI) films limits their applications in flexible electronics, such as in wearable and implantable bio-MEMS devices. In this paper, an atmospheric pressure Ar/H2O microplasma jet (μAPPJ) with a nozzle diameter of 100 μm was utilized to site-selectively tune the surface hydrophilicity of a PI film. The electrical and optical characteristics of the μAPPJ were firstly investigated, and the results showed that multi-spikes occurred during the plasma discharge and that diverse reactive species, such as O atoms and OH radicals, were generated in the plasma plume. The physical and chemical properties of pristine and microplasma-modified PI surfaces were characterized by the water contact angle (WCA), atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS). The wettability of the PI surface was significantly enhanced after microplasma modification, and the WCA could be adjusted by varying the applied voltage, water vapor content, plasma treatment time and storage time. The AFM images indicated that the surface roughness increased after the plasma treatment, which partially contributed to an improvement in the surface hydrophilicity. The XPS results showed a reduction in the C content and an increase in the O content, and abundant hydrophilic polar oxygen-containing functional groups were also grafted onto the PI film surface. Finally, the interaction mechanism between the PI molecular chains and the microplasma is discussed. The breaking of C-N and C-O bonds and the grafting of OH radicals were the key pathways to dominate the reaction process.

Keywords

• microplasma jet
• polyimide film micromachining
• surface modification
• hydrophilicity tailoring