Micromachines (Nov 2023)

Structural Design and Optimization of the Milling Force Measurement Tool System Embedded with Thin-Film Strain Sensors

  • Xiangtao Song,
  • Wenge Wu,
  • Yongjuan Zhao,
  • Yunping Cheng,
  • Lijuan Liu

DOI
https://doi.org/10.3390/mi14122133
Journal volume & issue
Vol. 14, no. 12
p. 2133

Abstract

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A milling force measurement tool system is designed with an elastic beam structure, which is divided into a two-end ring hoop compression sensor mode and a two-end square hoop compression sensor mode to improve the strain sensitivity. A simplified mechanical model of the elastic beam is established, and the relationship between the strain and force of the elastic beam under the action of three cutting force components is investigated, which can act a guide for subsequent milling force measurement tool system calibration tests. Thin-film strain sensors occupy a central position in the milling force measurement tool system, which consists of a substrate, transition layer, insulating layer and resistance grid layer. The resistance grid layer has a particularly significant effect on the thin-film strain sensor’s performance. In order to further improve the sensitivity of thin-film strain sensors, the shapes of the substrate, the transition layer, the insulating layer and the resistance grid layer are optimized and studied. A new thin-film strain sensor is designed with a resistance grid beam constructed from an insulating layer and a resistive grid layer double-end-supported on the transition layer. The flow of the wet-etching process of thin-film strain sensors is studied and samples are obtained. The surface microforms of the sensor samples are observed by extended depth-of-field microscopy, confocal microscopy and atomic force microscopy. It can be seen that the boundary of the resistance grid layer pattern is tidy and has high dimensional accuracy, thus enabling the basic achievement of the expected effect of the design. The electrical performance of the samples is tested on an experimental platform that we built, and the results show that the resistive sensitivity coefficient of the samples is increased by about 20%, to 51.2%, compared with that of the flat thin-film strain sensor, which fulfils the design’s requirements.

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