Journal of Nanobiotechnology (Jun 2024)

Melt-electrowriting-enabled anisotropic scaffolds loaded with valve interstitial cells for heart valve tissue Engineering

  • Chao Xu,
  • Kun Yang,
  • Yin Xu,
  • Xiangfu Meng,
  • Ying Zhou,
  • Yanping Xu,
  • Xueyao Li,
  • Weihua Qiao,
  • Jiawei Shi,
  • Donghui Zhang,
  • Jianglin Wang,
  • Weilin Xu,
  • Hongjun Yang,
  • Zhiqiang Luo,
  • Nianguo Dong

DOI
https://doi.org/10.1186/s12951-024-02656-5
Journal volume & issue
Vol. 22, no. 1
pp. 1 – 18

Abstract

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Abstract Tissue engineered heart valves (TEHVs) demonstrates the potential for tissue growth and remodel, offering particular benefit for pediatric patients. A significant challenge in designing functional TEHV lies in replicating the anisotropic mechanical properties of native valve leaflets. To establish a biomimetic TEHV model, we employed melt-electrowriting (MEW) technology to fabricate an anisotropic PCL scaffold. By integrating the anisotropic MEW-PCL scaffold with bioactive hydrogels (GelMA/ChsMA), we successfully crafted an elastic scaffold with tunable mechanical properties closely mirroring the structure and mechanical characteristics of natural heart valves. This scaffold not only supports the growth of valvular interstitial cells (VICs) within a 3D culture but also fosters the remodeling of extracellular matrix of VICs. The in vitro experiments demonstrated that the introduction of ChsMA improved the hemocompatibility and endothelialization of TEHV scaffold. The in vivo experiments revealed that, compared to their non-hydrogel counterparts, the PCL-GelMA/ChsMA scaffold, when implanted into SD rats, significantly suppressed immune reactions and calcification. In comparison with the PCL scaffold, the PCL-GelMA/ChsMA scaffold exhibited higher bioactivity and superior biocompatibility. The amalgamation of MEW technology and biomimetic design approaches provides a new paradigm for manufacturing scaffolds with highly controllable microstructures, biocompatibility, and anisotropic mechanical properties required for the fabrication of TEHVs.

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