A study on the reliability of relay protection devices considering dynamic changes in temperature stress

Abstract

Relay protection devices contain numerous electronic components， and environmental factors such as temperature， humidity， and vibration can impact their reliability. Addressing the complex dynamic changes in temperature stress experienced by protection devices installed in switchgear during operation， this study considers environmental temperature as a random variable following a normal distribution. Based on the Arrhenius model and the Weibull model， conditional probability density functions along with probability density functions of temperature stress distribution are used to derive the overall probability density function， reliability function， and failure rate function of protection devices. Through numerical computation， the study assesses the impact of changes in temperature mean and variance parameters on the reliability of protection devices， providing a theoretical basis for reliability research on relay protection devices during field operation.

Keywords

• relay protection device
• reliability
• temperature stress
• normal distribution
• arrhenius model
• weibull model