Mechanical Engineering Journal (Dec 2014)

Characterization of the bond quality of adhesive plates utilizing zero-group-velocity Lamb waves measured by a laser ultrasonics technique

  • Hideo CHO,
  • Yudai YAGUCHI,
  • Hiroaki ITO

DOI
https://doi.org/10.1299/mej.14-00335
Journal volume & issue
Vol. 2, no. 1
pp. 14-00335 – 14-00335

Abstract

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The bonding quality of an adhesive component was estimated using the frequency of zero-group-velocity (ZGV) Lamb waves, which can be generated and detected with a laser ultrasonic technique. Two distinct peaks corresponding to ZGV Lamb waves in the amplitude spectrum were obtained for well- and weak-bonded adhesive plate samples. The frequency difference between the measured low frequency mode and the calculated frequency, which can be obtained by assuming a continuous stress and strain at a bonding interface, linearly increased with shear strength, as obtained by the shear-tensile test. The frequency of ZGV Lamb waves was also calculated with reduced shear modulus of the bonding layer to express a weak bonding, and the change in the calculated frequency in low frequency ZGV Lamb waves showed a similar tendency to that in measured one.

Keywords